Patents

• J. Shin, D. Um, and W.H. Lee, Apparatuses and method for Automated Photography, Patent Pending.

• W.H. Lee, C. Nothnagle, J. Shin, M.B. Wijesundara, US 9,415,591, Apparatuses and methods for electrohydrodynamic printing, Issued: August 16, 2016.

• J. Sin and W.H. Lee, US 7710574, Devices in miniature for interferometric use and fabrication thereof, Issued: May 4, 2010.

• W.H. Lee and J. Sin, US 7407431, Optical Fiber Polishing and Finishing System, Device and Method, Issued: August 5, 2008.

Publications

Robotics

• D. Um, J. Park, J. Shin, W.H Lee, A Social Robot, ‘Dali,’ for Aging in Place Technology, Journal of Robotics, vol. 2018, pp. 1-8, Aug, 2018.

• F. Mirza, R. Sahasrabuddhe, J. Baptist, M. Wijesundara, W.H. Lee, D. Popa, Piezoresistive pressure sensor array for robotic skin, SPIE Sensors for Next-Generation Robotics, Baltimore, MD, 2016.

• S. Das, J. Baptist, R. Sahasrabuddhe, W.H. Lee, D. Popa, Package analysis of 3D-printed piezoresistive strain gauge sensors, SPIE Sensors for Next-Generation Robotics, Baltimore, MD, 2016.

• K. Shook, A. Habib, W.H. Lee, and D. Popa, Experimental testbed for robotic skin characterization and interaction control, SPIE Sensors for Next-Generation Robotics, Baltimore, MD, 2014.

• Y.S. Park, W.H. Lee, N. Gopalsami, M.M. Gundeti, Tactile MEMS-based Sensor for Delicate Microsurgery, SPIE Sensors for Next-Generation Robotics, Baltimore, MD, 2014.

• M. Mayyas, W.H. Lee, and H. Stephanou, “Microrobotics Surveillance: Discrete and Continuous Starbot,” Proc. SPIE 8045, Orlando, FL, May, 2011.

• W.H. Lee and A.C. Sanderson, “Dynamic Rolling Locomotion and Control of Modular Robots,” IEEE Trans. on Robotics and Automation, vol. 18, no. 1, pp. 32-41, 2002.

• W.H. Lee and A.C. Sanderson, “Dynamic Analysis and Distributed Control of the Tetrobot Modular Reconfigurable Robotic System,” Autonomous Robots, vol. 10, pp. 67-82, 2001.

• A.C. Sanderson and W.H. Lee, “Self-Reconfiguration of Modular Tetrobot Truss Structures,” IEEE Conf. on Robotics and Automation Workshop of Self-Reconfigurable Robots, May, 2001.

• W.H. Lee and A.C. Sanderson, “Dynamics and Distributed Control of Modular Robotic Systems,” IEEE Int'l Conf. on Ind. Elec., Control and Inst., Nagoya, Japan, October, 2000.

• W.H. Lee and A.C. Sanderson, “Dynamic Rolling, Locomotion Planning, and Control of an Icosahedral Modular Robot,” IEEE/RSJ Int'l Conf. on Intelligent Robots and Systems, Takamatsu, Japan, October, 2000.

• W.H. Lee and A.C. Sanderson, “Dynamic Rolling of Modular Robots,” IEEE Int'l Conf. on Robotics and Automation, April, pp. 2840-2846, 2000.

• W.H. Lee and A.C. Sanderson, “Distributed Computation of Dynamics in Reconfigurable Robotics,” IEEE/RSJ Int'l Conf. on Intelligent Robots and Systems, Oct., pp. 1561-1566, 1999.

• W.H. Lee and A.C. Sanderson, “Dynamics and Distributed Control of Tetrobot Modular Robots,” IEEE Int'l Conf. on Robotics and Auto., pp. 2704-2710, May, 1999.

• W.H. Lee and A.C. Sanderson, “Distributed Control and Computation in a Parallel Modular Robotic System,” SPIE, Sensor Fusion and Decentralized Control in Robotic Systems II, vol. 3839-23, pp. 192-201, September, Boston, 1999.

• W.H. Lee and A.C. Sanderson, “Dynamic Simulation of Tetrahedron-Based Tetrobot,” IEEE/RSJ Int'l Conf. on Intel. Robots and Systems, pp. 630-635, Oct., 1998.

Microtechnology

• C. Nothnagle, J.R. Baptist, J. Sanford, W.H. Lee, D. Popa, M. Wijesundara, EHD Printing of PEDOT:PSS inks for fabricating pressure and strain sensor arrays on flexible substrates, SPIE Sensors for Next-Generation Robotics, Baltimore, MD, 2015.

• R. Sidhu, J. Sin, W.H. Lee, H. Stephanou, and M. Wijesundara, “Electrohydrodynamic Printing of Metal Oxide Microstructures,” Proc. 7th ICOMM, pp. 458-461, Chicago, IL, March, 2012.

• S. Son, S. Lee, Y.J. Kim, J. Choi, J. Sin, W.H. Lee, M. Wijesundara, and H. Stephanou, “Array-Nozzle EHD Print Head and its Drop-on-Demand Experimentation,” Nanotech Con. & Expo, Boston, MA, June, 2011.

• J. Sin, W.H. Lee, and H. Stephanou, “Sensitivity Analysis of an Assembled Fourier Transform Microspectrometer,” Proc. SPIE, Vo. 7680, Orlando, FL, 2010.

• J. Sin, W.H. Lee, M. Mittal, M. Mayyas, and H. Stephanou, “Manufacturability Analysis of Assembled FT Microspectrometer,” Optical MEMS and Nanophotonics, IEEE/LEOS Int. Conf., FL, 2009.

• M. Mayyas, P.S. Shiakolas, W.H. Lee, and H. Stephanou, “Thermal cycle modeling of electrothermal microactuators,” Sensors and Actuators, 2009.

• M. Mayyas, P. Zhang, W.H. Lee, D. Popa, and J.C. Chiao, “An Active Micro Joining Mechanism for 3D Assembly,” Journal of Micromechanics and Microengineering, 19, 035012, 2009.

• H. Kim, W.H. Lee, H.V. Dias, and S. Priya, “Piezoelectric Microgenerators – Current Status and Challenges,” IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 56, no. 8, August, pp.1555-1568, 2009.

• G. Zimbru, W. Lee, and D. Popa, “Design and Fabrication of Microflap Actuators for Steering of Micro Air Vehicles,” Proc. SPIE Int. Soc. Opt. Eng., 7318, 2009.

• H. Kim, V. Bedekar, R. Islam, W.H. Lee, D. Leo, and S. Priya, “Laser-Machined Piezoelectric Cantilevers for Mechanical Energy Harvesting,” IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 55, no. 9, September, pp. 1900-1905, 2008.

• H. Kim, V. Bedekar, R. Mahanjan, W.H. Lee, and S. Priya, “Cost-effective piezoelectric micro energy harvesting system,” SPIE Smart Structures/NDE, San Diego, CA, March 2008.

• V. Sharma, M. R. Hossu, W.H. Lee, A.R. Koymen, and S. Priya, “Effect of A-site dopant on the piezoresistive characteristics of La0.8Sr0.2MnO3 ceramics,” Journal of Materials Science, July 2007.

• D. Popa, W.H. Lee, R. Murthy, A. Das, H. Stephanou, “High Yield Automated MEMS Assembly,” IEEE Conference on Automation Science and Engineering, Scottsdale, Arizona, September 2007.

• N. Lakhkar, A. Fasoro, W.H. Lee, D. Popa, D. Agonafer, and H. Stephanou, “Process Development and Die Shear Testing in MOEMS Packaging,” ASME InterPACK’07, British Columbia, Canada, July 2007.

• A.N. Das, P. Zhang, W.H. Lee, and D. Popa, “μ3 Multiscale, Deterministic Micro-Nano Assembly System for Construction of On-Wafer Microrobots,” IEEE Int'l Conf. on Robotics and Automation, Roma, Italy, April 2007.

• M. Mayyas, P. Zhang, W.H. Lee, and D. Popa, “Design Tradeoffs for Electrothermal Microgrippers,” IEEE Int'l Conf. on Robotics and Automation, Roma, Italy, April 2007.

• V. Sharma, M.R. Hossu, W.H. Lee, A.R. Koymen, add S. Priya, “Enhanced piezoresistive characteristics of Nb2O5 modified La0.8Sr0.2MnO3 ceramics,” Applied Physics Letters, 89, 202902, 2006.

• P. Zhang, M. Mayyas, W.H Lee, D. Popa, P. Shiakolas, H. Stephanou, and J.C. Chiao, “Active Locking Mechanisms for Assembling 3D Micro Structures,” SPIE Smart Materials, Nano-and Micro-Smart Systems, Adelaide, Australia, December 2006.

• A. Fasoro, P. Pandojirao-S, W.H. Lee, D.O. Popa, H. Stephanou, and D. Agonafer, “Die and Wafer-Level Hermetic Sealing Using Sn/An Solder for MEMS Applications,” TexMEMS VIII Workshop, Dallas, TX, 2006.

• M. Mayyas, P. Zhang, P. Shiakolas, W.H. Lee, D. Popa, and H. Stephanou, “Issues in the Current and Thermal Distribution for a Probed Electrothermal MEMS Actuator of Parallel Resistive Structure,” TexMEMS VIII Workshop, Dallas, TX, 2006.

• D. Popa, W.H. Lee, J. Sin, A.N. Das, R. Murthy, and P. Zhang, “M3 and μ3: Multiscale, Deterministic Micro-Nano Assembly Systems for Construction of On-Wafer Microrobots,” TexMEMS VIII Workshop, Dallas, TX, 2006.

• P. Zhang, M. Mayyas, W.H. Lee, D. Popa, P. Shiakolas, H. Stephanou, and J.C. Chiao, “Design of an Active Lock for Integrating 3D Micro Structures,” TexMEMS VIII Workshop, Dallas, TX, 2006.

• S. Priya, S. Mukherjee, W.H. Lee, and H. Stephanou, “Piezoelectric Energy Harvesting,” Material Science & Technology Conference, Cincinnati, OH, 2006.

• M. Mayyas, P. Shiakolas, W.H. Lee, D. Popa, and H. Stephanou, “Static and dynamic modeling of thermal microgripper,” MED06-14th Mediterranean Conference in Automation and Control, Ancona, Italy, June 2006.

• S. Mukherjee, W.H. Lee, R.A. Islam, and S. Priya, “High Energy Density Piezoelectric Materials and Applications,” 2006 U.S. Navy Workshop on Acoustic Transduction Materials and Devices, The Penn State Conference Center, Pennsylvania, May 2006.

• W.H. Lee, D. Popa, J. Sin, V. George, and H.E. Stephanou, “Compliant Microassembly of MEMS,” Sharing Solutions for Emergencies and Hazardous Environments, Utah, February 2006.

• A. Fasoro, A. Patil, D. Popa, J. Sin, W.H. Lee, H. Beardsley, D. Agonafer, and H. Stephanou, “Fluxless Soldering for Hermetic Packaging of MOEMS,” IMAPS International Conference and Exhibition on Device Packaging, San Diego, CA, October 2006.

• A. Kole, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H. Stephanou, “Design of Polymer Tube Embedded In-Plane Micropump,” ITHERM, San Diego, 2006.

• J. Sin, W.H. Lee, D. Popa, and H.E. Stephanou, “Assembled Fourier Transform Micro-spectrometer,” SPIE MOEMS-MEMS, January, San Jose, 2006.

• D. Popa, M. Deeds, A. Fasoro, H. Beardsley, J. Sin, W.H. Lee, and R. Fernandez, “Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives,” ASME Int. Mechanical Engineering Congress & Exposition, November, 2005.

• A.S. Kole, K. Bushan, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H.E. Stephanou, “Polymer tube embedded in-plane micropump: design, analysis and fabrication,” ASME Int. Mechanical Engineering Congress & Exposition, November, 2005.

• A.S. Kole, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H.E. Stephanou, “Polymer tube embedded in-plane micropump,” TexMEMS VII International Conference on Micro Electro Mechanical, El Paso, Texas, September, 2005.

• A. Fasoro, A. Patil, W.H. Lee, J. Sin, H. Beardsley, D. Popa, and H.E. Stephanou, “Fluxless Soldering of MOEMS,” TexMEMS VII International Conference on Micro Electro Mechanical, El Paso, Texas, September, 2005.

• M. Mayyas, W.H. Lee, D. Popa, P. Shiakolas, P. Zhang, and H.E. Stephanou, “Comprehensive Electrothermal Modeling of a Thermal Microgripper,” TexMEMS VII International Conference on Micro Electro Mechanical Systems, El Paso, Texas, September, 2005.

• L.-C. Hsu, V. George, D. Popa, W.H. Lee, M. Mayyas, P. Zhang, H.E. Stephanou, and J.C. Chiao, “3D Microassembly Station,” TexMEMS VII International Conference on Micro Electro Mechanical, El Paso, Texas, September, 2005.

• D. Popa, W.H. Lee, H.E. Stephanou, “Towards New Paradigms for MEMS Assembly,” in Proceedings of SME Automation & Assembly Summit, Saint Louis, April, 2005.

• W. H. Lee, M. Dafflon, H.E. Stephanou, Y.S. Oh, J. Hochberg, and G.D. Skidmore, “Tolerance Analysis of Placement Distributions in Tethered Micro-Electro-Mechanical systems Components,” IEEE Int'l Conf. on Robotics and Automation, May, 2004.

• J. Sin, W.H. Lee, and H. E. Stephanou, “In-Plane Micropump: Design Optimization,” Nanotech2004, March, Boston, 2004.

• W.H. Lee, B.H. Kang, Y.S. Oh, H. Stephanou, A.C. Sanderson, G. Skidmore, and M. Ellis, “Micropeg Manipulation with a Compliant Microgripper,” IEEE Int'l Conf. on Robotics and Automation, September, pp. 3213-3218, 2003.

• Y.S. Oh, W.H. Lee, H.E. Stephanou, and G.D. Skidmore, “Design, Optimization, and Experiments of Compliant Microgripper,” ASME Int. Mecha. Eng. Congress & Expo., 2003.

• D. Messia, J. Pegna, and W.H. Lee, “Layered Micro-Wall Structures from Gas Phase,” Solid Freeform Fabrication Symposium Proc., pp. 231-240, August, 1997.

• J. Pegna, D. Messia, and W.H. Lee, “Trussed Structures: Free Form Fabrication without the Layers,” Solid Freeform Fabrication Sympo. Proc., pp. 49-58, Aug., 1997.